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dc.contributor.authorDrápala, Jaromír
dc.contributor.authorKubíček, P.
dc.contributor.authorKostiuková, Gabriela
dc.contributor.authorJopek, Pavel
dc.date.accessioned2013-06-07T07:38:51Z
dc.date.available2013-06-07T07:38:51Z
dc.date.issued2013
dc.identifier.citationMetalurgija. 2013, vol. 52, no. 4, p. 509-511.cs
dc.identifier.issn0543-5846
dc.identifier.issn1334-2576
dc.identifier.urihttp://hdl.handle.net/10084/96404
dc.description.abstractProblems of reactive diff usion at the interface solid phase - melt were studied theoretically and experimentally. A theoretical description of the kinetics of dissolution of the solid phase in the melt is presented for the case of planar dissolution. The main intention was to study experimentally the copper dissolution in melts of various solder alloys and the related reactive diff usion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu plate dissolving in the solder melt were carried out at various conditions. Concentration profi les of elements and thickness of layers of phases were determined by SEM and X-ray microanalyses (WDX, EDX) of specimens after their heating.cs
dc.format.extent1115235 bytescs
dc.format.mimetypeapplication/pdfcs
dc.languageen
dc.language.isoencs
dc.publisherHrvatsko Metalurško Društvocs
dc.relation.ispartofseriesMetalurgijacs
dc.relation.urihttp://hrcak.srce.hr/file/148602cs
dc.subjectlead-free solderscs
dc.subjectcoppercs
dc.subjecttincs
dc.subjectsilvercs
dc.subjectintermetallic compoundscs
dc.subjectdiff usioncs
dc.titleStudy of interaction between copper and melt of lead-free solderscs
dc.typearticlecs
dc.identifier.locationNení ve fondu ÚKcs
dc.rights.accessopenAccess
dc.type.versionpublishedVersioncs
dc.type.statusPeer-reviewedcs
dc.description.sourceWeb of Sciencecs
dc.description.volume52cs
dc.description.issue4cs
dc.description.lastpage511cs
dc.description.firstpage509cs
dc.identifier.wos000318059400019


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