Prohlížení dle autora "Babincová, Paulína"

Characterization of Sn-Sb-Ti solder alloy and the study of its use for the ultrasonic soldering process of SiC ceramics with a Cu-SiC metal-ceramic composite

Koleňák, Roman; Kostolný, Igor; Drápala, Jaromír; Babincová, Paulína; Pašák, Matej (Materials. 2021, vol. 14, issue 21, art. no. 6369.)

Characterization of soldering alloy type Bi-Ag-Ti and the study of ultrasonic soldering of silicon and copper

Koleňák, Roman; Kostolný, Igor; Drápala, Jaromír; Babincová, Paulína; Gogola, Peter (Metals. 2021, vol. 11, issue 4, art. no. 624.)

Characterization of Zn-Mg-Sr type soldering alloy and study of ultrasonic soldering of SiC ceramics and Cu-SiC composite

Koleňák, Roman; Pluhár, Alexej; Drápala, Jaromír; Babincová, Paulína; Pašák, Matej (Materials. 2023, vol. 16, issue 10, art. no. 3795.)

Characterizing the soldering alloy type Zn-Al-Cu and study of ultrasonic soldering of Al7075/Cu combination

Koleňák, Roman; Kostolný, Igor; Drápala, Jaromír; Babincová, Paulína; Sahul, Martin (Metals. 2021, vol. 11, issue 1, art. no. 27.)

Study of wettability and solderability of SiC ceramics with Ni by use of Sn-Sb-Ti solder by heating with electron beam in vacuum

Koleňák, Roman; Kostolný, Igor; Drápala, Jaromír; Urminský, Ján; Pluhár, Alexej; Babincová, Paulína; Dřímal, Daniel (Materials. 2022, vol. 15, issue 15, art. no. 5301.)

Ultrasonic soldering of Al2O3 ceramics and Ni-SiC composite by use of Bi-based active solder

Meluš, Tomáš; Koleňák, Roman; Drápala, Jaromír; Babincová, Paulína; Pašák, Matej (AIMS Materials Science. 2023, vol. 10, issue 2, p. 213-226.)