Browsing by Author "Gogola, Peter"

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Characterization of soldering alloy type Bi-Ag-Ti and the study of ultrasonic soldering of silicon and copper

Koleňák, Roman; Kostolný, Igor; Drápala, Jaromír; Babincová, Paulína; Gogola, Peter (Metals. 2021, vol. 11, issue 4, art. no. 624.)
Study of bond formation in ceramic and composite materials ultrasonically soldered with Bi–Ag–Mg-type solder

Koleňák, Roman; Meluš, Tomáš; Drápala, Jaromír; Gogola, Peter; Pašák, Matej (Materials. 2023, vol. 16, issue 8, art. no. 299.)