Browsing by Author "Meluš, Tomáš"
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Study of bond formation in ceramic and composite materials ultrasonically soldered with Bi–Ag–Mg-type solder
Koleňák, Roman; Meluš, Tomáš; Drápala, Jaromír; Gogola, Peter; Pašák, Matej (Materials. 2023, vol. 16, issue 8, art. no. 299.) -
Ultrasonic soldering of Al2O3 ceramics and Ni-SiC composite by use of Bi-based active solder
Meluš, Tomáš; Koleňák, Roman; Drápala, Jaromír; Babincová, Paulína; Pašák, Matej (AIMS Materials Science. 2023, vol. 10, issue 2, p. 213-226.)