Browsing by Author "Pašák, Matej"
Now showing items 1-5 of 5
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Characterization of Sn-Sb-Ti solder alloy and the study of its use for the ultrasonic soldering process of SiC ceramics with a Cu-SiC metal-ceramic composite
Koleňák, Roman; Kostolný, Igor; Drápala, Jaromír; Babincová, Paulína; Pašák, Matej (Materials. 2021, vol. 14, issue 21, art. no. 6369.) -
Characterization of Zn-Mg-Sr type soldering alloy and study of ultrasonic soldering of SiC ceramics and Cu-SiC composite
Koleňák, Roman; Pluhár, Alexej; Drápala, Jaromír; Babincová, Paulína; Pašák, Matej (Materials. 2023, vol. 16, issue 10, art. no. 3795.) -
Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder
Koleňák, Roman; Kostolný, Igor; Drápala, Jaromír; Kusý, Martin; Pašák, Matej (Soldering & Surface Mount Technology. 2019, vol. 31, issue 2, p.93-101.) -
Study of bond formation in ceramic and composite materials ultrasonically soldered with Bi–Ag–Mg-type solder
Koleňák, Roman; Meluš, Tomáš; Drápala, Jaromír; Gogola, Peter; Pašák, Matej (Materials. 2023, vol. 16, issue 8, art. no. 299.) -
Ultrasonic soldering of Al2O3 ceramics and Ni-SiC composite by use of Bi-based active solder
Meluš, Tomáš; Koleňák, Roman; Drápala, Jaromír; Babincová, Paulína; Pašák, Matej (AIMS Materials Science. 2023, vol. 10, issue 2, p. 213-226.)