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dc.contributor.authorHajnyš, Jiří
dc.contributor.authorPagáč, Marek
dc.contributor.authorMěsíček, Jakub
dc.contributor.authorPetrů, Jana
dc.contributor.authorKról, Mariusz
dc.date.accessioned2020-06-18T12:23:32Z
dc.date.available2020-06-18T12:23:32Z
dc.date.issued2020
dc.identifier.citationMaterials. 2020, vol. 13, issue 7, art. no. 1659.cs
dc.identifier.issn1996-1944
dc.identifier.urihttp://hdl.handle.net/10084/139546
dc.description.abstractThe present paper deals with the investigation and comparison of the influence of scanning strategy on residual stress in the selective laser melting (SLM) process. For the purpose of the experiment, bridge geometry samples were printed by a 3D metal printer, which exhibited tension after cutting from the substrate, slightly bending the samples toward the laser melting direction. Samples were produced with the variation of process parameters and with a change in scanning strategy which plays a major role in stress generation. It was evaluated using the Bridge Curvature Method (BCM) and optical microscopy. At the end, a recommendation was made.cs
dc.language.isoencs
dc.publisherMDPIcs
dc.relation.ispartofseriesMaterialscs
dc.relation.urihttp://doi.org/10.3390/ma13071659cs
dc.rights© 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.cs
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/cs
dc.subjectscanning strategycs
dc.subjectresidual stresscs
dc.subjectSLMcs
dc.subjectAISI316Lcs
dc.subjectBCMcs
dc.titleInfluence of scanning strategy parameters on residual stress in the SLM process according to the Bridge Curvature Method for AISI 316L stainless steelcs
dc.typearticlecs
dc.identifier.doi10.3390/ma13071659
dc.rights.accessopenAccesscs
dc.type.versionpublishedVersioncs
dc.type.statusPeer-reviewedcs
dc.description.sourceWeb of Sciencecs
dc.description.volume13cs
dc.description.issue7cs
dc.description.firstpageart. no. 1659cs
dc.identifier.wos000529875600177


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© 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.
Except where otherwise noted, this item's license is described as © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.