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Characterizing the soldering alloy type Zn-Al-Cu and study of ultrasonic soldering of Al7075/Cu combination

dc.contributor.authorKoleňák, Roman
dc.contributor.authorKostolný, Igor
dc.contributor.authorDrápala, Jaromír
dc.contributor.authorBabincová, Paulína
dc.contributor.authorSahul, Martin
dc.date.accessioned2021-03-15T11:51:30Z
dc.date.available2021-03-15T11:51:30Z
dc.date.issued2021
dc.identifier.citationMetals. 2021, vol. 11, issue 1, art. no. 27.cs
dc.identifier.issn2075-4701
dc.identifier.urihttp://hdl.handle.net/10084/142960
dc.description.abstractThe aim of the research was to characterize the soldering alloy type Zn-Al-Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate. The Zn-Al-Cu solder is of the close-to-eutectic type with two phase transformations: the eutectic transformation at 378 degrees C and the eutectoid transformation at 285 degrees C. The solder microstructure is formed of a matrix composed of the solid solutions of aluminum (Al) and zinc (Zn) in which the copper phases CuZn4 and CuAl2 are precipitated. The shear strength of the soldering alloy type Zn5Al with copper addition reaches values from 167 to 187 MPa and it depends on the copper content in the solder. The bond with aluminum alloy type Al7075 is formed due to the solubility of Al in zinc solder at the formation of solid solution Al. Contrary to this observation, the bond with the copper substrate is in this case formed due to the interaction of zinc and aluminum with the copper substrate. Two new intermetallic phases, namely Al(Cu,Zn)(2) and Cu3.2Zn0.7Al4.2, were formed. The average shear strength of Al7075/Zn5Al3Cu/Cu joints attained was 134.5 MPa. For comparison, the Cu/Zn5Al3Cu/Cu joint attained an average shear strength of 136.5 MPa.cs
dc.language.isoencs
dc.publisherMDPIcs
dc.relation.ispartofseriesMetalscs
dc.relation.urihttp://doi.org/10.3390/met11010027cs
dc.rights© 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.cs
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/cs
dc.subjectsolderingcs
dc.subjectultrasoniccs
dc.subjectintermetallic compoundscs
dc.subjectshear strengthcs
dc.titleCharacterizing the soldering alloy type Zn-Al-Cu and study of ultrasonic soldering of Al7075/Cu combinationcs
dc.typearticlecs
dc.identifier.doi10.3390/met11010027
dc.rights.accessopenAccesscs
dc.type.versionpublishedVersioncs
dc.type.statusPeer-reviewedcs
dc.description.sourceWeb of Sciencecs
dc.description.volume11cs
dc.description.issue1cs
dc.description.firstpageart. no. 27cs
dc.identifier.wos000610504500001


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© 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.
Except where otherwise noted, this item's license is described as © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.