Zobrazit minimální záznam

Characterization of soldering alloy type Bi-Ag-Ti and the study of ultrasonic soldering of silicon and copper

dc.contributor.authorKoleňák, Roman
dc.contributor.authorKostolný, Igor
dc.contributor.authorDrápala, Jaromír
dc.contributor.authorBabincová, Paulína
dc.contributor.authorGogola, Peter
dc.date.accessioned2021-07-01T11:20:44Z
dc.date.available2021-07-01T11:20:44Z
dc.date.issued2021
dc.identifier.citationMetals. 2021, vol. 11, issue 4, art. no. 624.cs
dc.identifier.issn2075-4701
dc.identifier.urihttp://hdl.handle.net/10084/143144
dc.description.abstractThe aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 degrees C and full melting is completed at 405 degrees C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.cs
dc.language.isoencs
dc.publisherMDPIcs
dc.relation.ispartofseriesMetalscs
dc.relation.urihttps://doi.org/10.3390/met11040624cs
dc.rights© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.cs
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/cs
dc.subjectultrasonic solderingcs
dc.subjectactive soldercs
dc.subjectsiliconcs
dc.subjectcoppercs
dc.titleCharacterization of soldering alloy type Bi-Ag-Ti and the study of ultrasonic soldering of silicon and coppercs
dc.typearticlecs
dc.identifier.doi10.3390/met11040624
dc.rights.accessopenAccesscs
dc.type.versionpublishedVersioncs
dc.type.statusPeer-reviewedcs
dc.description.sourceWeb of Sciencecs
dc.description.volume11cs
dc.description.issue4cs
dc.description.firstpageart. no. 624cs
dc.identifier.wos000643281000001


Soubory tohoto záznamu

Název:
2075-4701-2021v11i4an624.pdf
Velikost:
10.04Mb
Formát:
PDF
Zobrazit/otevřít

Tento záznam se objevuje v následujících kolekcích

Zobrazit minimální záznam

© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.
Kromě případů, kde je uvedeno jinak, licence tohoto záznamu je © 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.