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Study of wettability and solderability of SiC ceramics with Ni by use of Sn-Sb-Ti solder by heating with electron beam in vacuum

dc.contributor.authorKoleňák, Roman
dc.contributor.authorKostolný, Igor
dc.contributor.authorDrápala, Jaromír
dc.contributor.authorUrminský, Ján
dc.contributor.authorPluhár, Alexej
dc.contributor.authorBabincová, Paulína
dc.contributor.authorDřímal, Daniel
dc.date.accessioned2022-10-17T12:24:48Z
dc.date.available2022-10-17T12:24:48Z
dc.date.issued2022
dc.identifier.citationMaterials. 2022, vol. 15, issue 15, art. no. 5301.cs
dc.identifier.issn1996-1944
dc.identifier.urihttp://hdl.handle.net/10084/148787
dc.description.abstractThe aim of this research was to study the wettability and solderability of SiC ceramics by the use of an active solder of the type Sn5Sb3Ti in a vacuum by electron beam heating. This solder exerts a narrow melting interval, and only one thermal effect, a peritectic reaction, was observed. The liquidus temperature of the solder is approximately 243 degrees C. The solder consists of a tin matrix where the Ti-6(Sb,Sn)(5) and TiSbSn phases are precipitated. The solder wettability on a SiC substrate decreases with decreasing soldering temperature. The best wetting angle of 33 degrees was obtained in a vacuum at the temperature of 950 degrees C. The bond between the SiC ceramics and the solder was formed due to the interaction of Ti and Ni with silicon contained in the SiC ceramics. The formation of new TiSi2 and Ti3Ni5Si6 phases, which form the reaction layer and thus ensure the bond formation, was observed. The bond with Ni is formed due to the solubility of Ni in the tin solder. Two phases, namely the Ni3Sn2 and Ni3Sn phases, were identified in the transition zone of the Ni/Sn5Sb3Ti joint. The highest shear strength, around 40 MPa, was attained at the soldering temperature of 850 degrees C.cs
dc.language.isoencs
dc.publisherMDPIcs
dc.relation.ispartofseriesMaterialscs
dc.relation.urihttps://doi.org/10.3390/ma15155301cs
dc.rights© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.cs
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/cs
dc.subjectactive soldercs
dc.subjectsolderabilitycs
dc.subjectwettabilitycs
dc.subjectelectron beamcs
dc.subjectSiC ceramicscs
dc.titleStudy of wettability and solderability of SiC ceramics with Ni by use of Sn-Sb-Ti solder by heating with electron beam in vacuumcs
dc.typearticlecs
dc.identifier.doi10.3390/ma15155301
dc.rights.accessopenAccesscs
dc.type.versionpublishedVersioncs
dc.type.statusPeer-reviewedcs
dc.description.sourceWeb of Sciencecs
dc.description.volume15cs
dc.description.issue15cs
dc.description.firstpageart. no. 5301cs
dc.identifier.wos000840225200001


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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.
Kromě případů, kde je uvedeno jinak, licence tohoto záznamu je © 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.