Zobrazit minimální záznam

Ultrasonic soldering of Al2O3 ceramics and Ni-SiC composite by use of Bi-based active solder

dc.contributor.authorMeluš, Tomáš
dc.contributor.authorKoleňák, Roman
dc.contributor.authorDrápala, Jaromír
dc.contributor.authorBabincová, Paulína
dc.contributor.authorPašák, Matej
dc.date.accessioned2023-11-22T07:31:43Z
dc.date.available2023-11-22T07:31:43Z
dc.date.issued2023
dc.identifier.citationAIMS Materials Science. 2023, vol. 10, issue 2, p. 213-226.cs
dc.identifier.issn2372-0468
dc.identifier.issn2372-0484
dc.identifier.urihttp://hdl.handle.net/10084/151767
dc.description.abstractThe aim of this research was to study the interaction and solderability of Al2O3 ceramics and Ni-SiC composite by use of an active solder type Bi11Ag1.5Ti1Mg. The chemical composition of the solder is 86.5 wt% Bi, 11 wt% Ag, 1.5 wt% Ti, 1 wt% Mg. Soldering was performed by ultrasonic activation. This solder has a wide melting interval with the initial melting temperature of 263 ℃, what corresponds to the eutectic reaction. The liquidus temperature of this solder was determined at 437 ℃. The bond between the ceramic and the solder is formed by the interaction of the active metals Bi, Ag and Mg with the surface of the substrate Al2O3. The thickness of the Mg reaction layer at the interface was approximately 0.8 μm. The bond at the interface between Ni-SiC and solder was formed due to the interaction of the active metals Bi, Ag, Mg and Ti. Feasibility of Bi11Ag1.5Ti1Mg solder was assessed on the basis of analyses of joint boundaries and joint shear strength measurements. The average shear strength of Al2O3/Bi11Ag1.5Ti1Mg/Ni-SiC joint was 54 MPa.cs
dc.language.isoencs
dc.publisherAIMScs
dc.relation.ispartofseriesAIMS Materials Sciencecs
dc.relation.urihttps://doi.org/10.3934/matersci.2023012cs
dc.rights© 2023 the Author(s), licensee AIMS Press. This is an open access article distributed under the terms of the Creative Commons Attribution Licensecs
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/cs
dc.subjectsolderingcs
dc.subjectAl2O3 ceramiccs
dc.subjectNi-SiC substratecs
dc.subjectBi soldercs
dc.subjectultrasonic solderingcs
dc.titleUltrasonic soldering of Al2O3 ceramics and Ni-SiC composite by use of Bi-based active soldercs
dc.typearticlecs
dc.identifier.doi10.3934/matersci.2023012
dc.rights.accessopenAccesscs
dc.type.versionpublishedVersioncs
dc.type.statusPeer-reviewedcs
dc.description.sourceWeb of Sciencecs
dc.description.volume10cs
dc.description.issue2cs
dc.description.lastpage226cs
dc.description.firstpage213cs
dc.identifier.wos000928119700002


Soubory tohoto záznamu

Název:
2372-0468-2023v10i2p213.pdf
Velikost:
1.110Mb
Formát:
PDF
Zobrazit/otevřít

Tento záznam se objevuje v následujících kolekcích

Zobrazit minimální záznam

© 2023 the Author(s), licensee AIMS Press. This is an open access article distributed under the terms of the Creative Commons Attribution License
Kromě případů, kde je uvedeno jinak, licence tohoto záznamu je © 2023 the Author(s), licensee AIMS Press. This is an open access article distributed under the terms of the Creative Commons Attribution License