dc.contributor.author | Kocich, Radim | |
dc.date.accessioned | 2024-01-26T09:32:00Z | |
dc.date.available | 2024-01-26T09:32:00Z | |
dc.date.issued | 2023 | |
dc.identifier.citation | Materials. 2023, vol. 16, issue 9, art. no. 3480. | cs |
dc.identifier.issn | 1996-1944 | |
dc.identifier.uri | http://hdl.handle.net/10084/151967 | |
dc.description.abstract | Thermomechanical processing combining plastic deformation and heat treatment is a
favorable way to enhance the performance and lifetime of bimetallic laminates, especially those
consisting of metals, which tend to form intermetallic layers on the interfaces when produced using
methods involving increased temperatures. The presented work focuses on optimizing the conditions
of thermomechanical treatment for an Al + Cu bimetallic laminate of innovative design involving
a shear-strain-based deformation procedure (rotary swaging) and post-process heat treatment in
order to acquire microstructures providing advantageous characteristics during the transfer of
direct and alternate electric currents. The specific electric resistivity, as well as microhardness, was
particularly affected by the structural features, e.g., grain size, the types of grain boundaries, and
grain orientations, which were closely related to the applied thermomechanical procedure. The
microhardness increased considerably after swaging (up to 116 HV02 for the Cu components), but it
decreased after the subsequent heat treatment at 350 ◦C. Nevertheless, the heat-treated laminates still
featured increased mechanical properties. The measured electric characteristics for DC transfer were
the most favorable for the heat-treated 15 mm bimetallic laminate featuring the lowest measured
specific electric resistivity of 22.70 × 10−9 Ωm, while the 10 mm bimetallic laminates exhibited
advantageous behavior during AC transfer due to a very low power loss coefficient of 1.001. | cs |
dc.language.iso | en | cs |
dc.publisher | MDPI | cs |
dc.relation.ispartofseries | Materials | cs |
dc.relation.uri | https://doi.org/10.3390/ma16093480 | cs |
dc.rights | © 2023 by the author. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution. | cs |
dc.rights.uri | http://creativecommons.org/licenses/by/4.0/ | cs |
dc.subject | bimetallic laminate | cs |
dc.subject | rotary swaging | cs |
dc.subject | microstructure | cs |
dc.subject | electric conductivity | cs |
dc.subject | microhardness | cs |
dc.title | Optimizing thermomechanical processing of bimetallic laminates | cs |
dc.type | article | cs |
dc.identifier.doi | 10.3390/ma16093480 | |
dc.rights.access | openAccess | cs |
dc.type.version | publishedVersion | cs |
dc.type.status | Peer-reviewed | cs |
dc.description.source | Web of Science | cs |
dc.description.volume | 16 | cs |
dc.description.issue | 9 | cs |
dc.description.firstpage | art. no. 3480 | cs |
dc.identifier.wos | 000987492800001 | |