Zobrazit minimální záznam

dc.contributor.authorKocich, Radim
dc.date.accessioned2024-01-26T09:32:00Z
dc.date.available2024-01-26T09:32:00Z
dc.date.issued2023
dc.identifier.citationMaterials. 2023, vol. 16, issue 9, art. no. 3480.cs
dc.identifier.issn1996-1944
dc.identifier.urihttp://hdl.handle.net/10084/151967
dc.description.abstractThermomechanical processing combining plastic deformation and heat treatment is a favorable way to enhance the performance and lifetime of bimetallic laminates, especially those consisting of metals, which tend to form intermetallic layers on the interfaces when produced using methods involving increased temperatures. The presented work focuses on optimizing the conditions of thermomechanical treatment for an Al + Cu bimetallic laminate of innovative design involving a shear-strain-based deformation procedure (rotary swaging) and post-process heat treatment in order to acquire microstructures providing advantageous characteristics during the transfer of direct and alternate electric currents. The specific electric resistivity, as well as microhardness, was particularly affected by the structural features, e.g., grain size, the types of grain boundaries, and grain orientations, which were closely related to the applied thermomechanical procedure. The microhardness increased considerably after swaging (up to 116 HV02 for the Cu components), but it decreased after the subsequent heat treatment at 350 ◦C. Nevertheless, the heat-treated laminates still featured increased mechanical properties. The measured electric characteristics for DC transfer were the most favorable for the heat-treated 15 mm bimetallic laminate featuring the lowest measured specific electric resistivity of 22.70 × 10−9 Ωm, while the 10 mm bimetallic laminates exhibited advantageous behavior during AC transfer due to a very low power loss coefficient of 1.001.cs
dc.language.isoencs
dc.publisherMDPIcs
dc.relation.ispartofseriesMaterialscs
dc.relation.urihttps://doi.org/10.3390/ma16093480cs
dc.rights© 2023 by the author. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution.cs
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/cs
dc.subjectbimetallic laminatecs
dc.subjectrotary swagingcs
dc.subjectmicrostructurecs
dc.subjectelectric conductivitycs
dc.subjectmicrohardnesscs
dc.titleOptimizing thermomechanical processing of bimetallic laminatescs
dc.typearticlecs
dc.identifier.doi10.3390/ma16093480
dc.rights.accessopenAccesscs
dc.type.versionpublishedVersioncs
dc.type.statusPeer-reviewedcs
dc.description.sourceWeb of Sciencecs
dc.description.volume16cs
dc.description.issue9cs
dc.description.firstpageart. no. 3480cs
dc.identifier.wos000987492800001


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Zobrazit minimální záznam

© 2023 by the author. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution.
Kromě případů, kde je uvedeno jinak, licence tohoto záznamu je © 2023 by the author. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution.