Studium kinetiky růstu intermetalických fází ve spojích Cu-pájka za podmínek reaktivní difuze

Abstract

The content of this thesis is a brief description of the basic characteristics of diffusion. It focuses on the theory of reactive diffusion in the dissolution of solid copper in the melt of tin solder. Furthermore, the thesis deals with the theory of growth kinetics of intermetallic phases during heat treatment, and one chapter is devoted to a description of lead-free solders and related problems during soldering. Experimental section contains layout and design of experiments suitable for the study of reactive diffusion, metallographic study and x-ray microanalysis of samples by EDAX, the calculations of diffusion flows and determination of the rate constants of dissolution.