Model tepelného pole chladiče v programu ANSYS
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Šprlák, Roman
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Vysoká škola báňská - Technická univerzita Ostrava
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Abstract
This thesis is focused on the characterization and simulation of thermal fields. This thesis prezents the various types of heat convection throught materials with using of physical laws. Dissipation of thermal energy is making a great difference to ensure long and trouble-free operation. Nowadays, when the great emphasis on reliability and maintenance-free state apparatus consists emphasis on the most effective heat dissipation. For this reason are used simulation programs for calculating the thermal field with the finite element method.In this thesis I deal with simulation of thermal field components in the semiconductor converters. In my own simulation I have been thinking only with transfer of heat energy from the line between the semiconductor modules and the heatsink.
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Import 29/09/2010
Subject(s)
conduct, simulation, model, module, emissivity, emission, temperature, convection, temperature field, computation network