Kinetická analýza vytvrzovacího reřimu skloslídových pásek

dc.contributor.authorPolanský, V.
dc.date.accessioned2011-02-04T12:12:05Z
dc.date.available2011-02-04T12:12:05Z
dc.date.issued2008
dc.description.abstract-enCuring program of thermoset insulating materials and its responsible setting has the key importance for assurance of high quality and reliability of electrical devices. It is possible to determine parameters of this program (temperature and time of curing) by several ways in practise. There is mostly focused on methods based on kinetic analysis. The result comparison of selected methods of kinetic analysis and residual enthalpy measurement is the main aim of the paper. Two insulating tapes were chosen for the purpose of this study. These tapes correspond in their composition (glass fabric, mica and epoxy binder), but they differ in curing agent type. Simultaneous thermal analysis (STA) was used during the measurements. Monitored results demonstrate the advantages and disadvantages of particular methods.en
dc.format.extent202300 bytescs
dc.format.mimetypeapplication/pdfcs
dc.identifier.citationAdvances in electrical and electronic engineering. 2008, vol. 7, no. 3, p. 411-415.en
dc.identifier.issn1336-1376
dc.identifier.urihttp://hdl.handle.net/10084/83886
dc.language.isocsen
dc.publisherŽilinská univerzita v Žiline. Elektrotechnická fakultaen
dc.relation.ispartofseriesAdvances in electrical and electronic engineeringen
dc.relation.urihttp://advances.utc.sk/index.php/AEEEen
dc.rightsCreative Commons Attribution 3.0 Unported (CC BY 3.0)
dc.rights© Žilinská univerzita v Žiline. Elektrotechnická fakulta
dc.rights.accessopenAccess
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/
dc.titleKinetická analýza vytvrzovacího reřimu skloslídových páseken
dc.title.alternativeKinetic analysis of mica tape curing processen
dc.typearticleen
dc.type.statusPeer-reviewedcs
dc.type.versionpublishedVersioncs

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