Electrostatic adhesion testing of thin metallic layers

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dc.contributor.authorDubec, Miroslav
dc.contributor.authorBrotzen, Franz R.
dc.contributor.authorDunn, Robert C.
dc.date.accessioned2007-08-09T12:15:08Z
dc.date.available2007-08-09T12:15:08Z
dc.date.issued1999
dc.description.abstract-enTesting of the adhesion strength of various metallizations on Si was carried out by a novel electrostatic technique. This technique made possible the evaluation of the characteristic adhesion stress and of the Weibull modulus, the latter being a measure of the distribution of weak adhesion spots. Adhesion characteristics of various metallic films (Cu, Ti–W, Al–Cu) were determined, and the effect of substrate treatments on these characteristics was analyzed.en
dc.identifier.citationJournal of Applied Physics. 1999, vol. 85, issue 10, p. 7477-7479.en
dc.identifier.doi10.1063/1.369382
dc.identifier.issn0021-8979
dc.identifier.issn1089-7550
dc.identifier.locationNení ve fondu ÚKen
dc.identifier.urihttp://hdl.handle.net/10084/61665
dc.identifier.wos000080136000072
dc.language.isoenen
dc.publisherAmerican Institute of Physicsen
dc.relation.ispartofseriesJournal of Applied Physicsen
dc.relation.urihttp://dx.doi.org/10.1063/1.369382en
dc.titleElectrostatic adhesion testing of thin metallic layersen
dc.typearticleen

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