Studium reaktivní difuze ve spojích Cu – pájka

Abstract

Study of reactive diffusion of solid state in the contact with melt

Theoretically and practically were studying problems of reactive diffusion of metal in solid state in contact with melt. In our case it was dissolution process of Cu in Sn melt at defined high temperature in time. Subject of research was creation of intermetallic phase, behavior of Cu in the molten solder and potential determination rate constant of dissolution of Cu in molten solder. Main goal was to determinate time dependence of dissolution of metal in solid state in case of the dissolution of long cylinder. These calculations were based on the assumption that the dissolution rate constant is a constant (K = const.). The experimental part includes design layout and interpretation of experiments suitable for the study of reactive diffusion, metallurgical studies, chemical and structural microanalysis (OES, EDX) and discusses the results of the analyses.