ESD Stress Analysis and Suppression in a Single-Junction Thermal Converter

Abstract

This article presents an outline of Elec- tric Transient Disturbances (ETDs), represented by the ElectroStatic Discharge (ESD) in accordance with the Human-Body Model (HBM), on the AC-DC trans- fer measurement standard, represented by the Single- Junction Thermal Converter (SJTC) Thermal Ele- ment (TE). Mitigation technique against the power dissipation build-up, higher than the operational mar- gins recommended by a manufacturer, on the TE were proposed and modelled using Laplace Transform (LT) analysis. A mathematical model and an optimiza- tion algorithm were developed to determine the equiva- lent circuit model parameters of a Transient Overload Protection Module (TOPM) that would offer adequate protection against destructive power dissipation levels build-up on the TE. The mathematical model was de- veloped using an 8 kV ESD, which was expected to de- liver short-circuit current with a peak value of approx- imately 5.33 A through a load impedance of approxi- mately 1 mΩ. The ESD stress signal was injected into the TOPM connected in parallel with the TE. The ac- tive power dissipated by the SJTC TE per period of transient response was calculated from the current and voltage obtained from the mathematical analysis, and the results indicate a power dissipation of 10 mW by the TE. From the algorithm, the model parameter that noticeably influences the power dissipation capabilities of the TOPM is the inductance and it must be smaller than 1.2 nH. A CAD based simulation model was devel- oped and analysed. The simulation results agreed with the mathematical model.