Kinetická analýza vytvrzovacího reřimu skloslídových pásek
| dc.contributor.author | Polanský, V. | |
| dc.date.accessioned | 2011-02-04T12:12:05Z | |
| dc.date.available | 2011-02-04T12:12:05Z | |
| dc.date.issued | 2008 | |
| dc.identifier.citation | Advances in electrical and electronic engineering. 2008, vol. 7, no. 3, p. 411-415. | en |
| dc.identifier.issn | 1336-1376 | |
| dc.identifier.uri | http://hdl.handle.net/10084/83886 | |
| dc.format.extent | 202300 bytes | cs |
| dc.format.mimetype | application/pdf | cs |
| dc.language.iso | cs | en |
| dc.publisher | Žilinská univerzita v Žiline. Elektrotechnická fakulta | en |
| dc.relation.ispartofseries | Advances in electrical and electronic engineering | en |
| dc.relation.uri | http://advances.utc.sk/index.php/AEEE | en |
| dc.rights | Creative Commons Attribution 3.0 Unported (CC BY 3.0) | |
| dc.rights | © Žilinská univerzita v Žiline. Elektrotechnická fakulta | |
| dc.rights.uri | http://creativecommons.org/licenses/by/3.0/ | |
| dc.title | Kinetická analýza vytvrzovacího reřimu skloslídových pásek | en |
| dc.title.alternative | Kinetic analysis of mica tape curing process | en |
| dc.type | article | en |
| dc.description.abstract-en | Curing program of thermoset insulating materials and its responsible setting has the key importance for assurance of high quality and reliability of electrical devices. It is possible to determine parameters of this program (temperature and time of curing) by several ways in practise. There is mostly focused on methods based on kinetic analysis. The result comparison of selected methods of kinetic analysis and residual enthalpy measurement is the main aim of the paper. Two insulating tapes were chosen for the purpose of this study. These tapes correspond in their composition (glass fabric, mica and epoxy binder), but they differ in curing agent type. Simultaneous thermal analysis (STA) was used during the measurements. Monitored results demonstrate the advantages and disadvantages of particular methods. | en |
| dc.rights.access | openAccess | |
| dc.type.version | publishedVersion | cs |
| dc.type.status | Peer-reviewed | cs |
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OpenAIRE [5085]
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AEEE. 2008, vol. 7 [106]
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