Simulace únavových zkoužek bezolovnaté pájky SAC305 pomocí MKP

Abstract

The thesis deals with the fatigue behaviour of lead-free solder SAC305. In the first part of the thesis, a research on published fatigue experiments of solder is presented. In the second, experimental part, fatigue tests at room temperature for different loading levels are planned and realized for the investigated material. The results of the fatigue tests are then analyzed and evaluated using Python scripts. In the third, numerical part, a combined model describing kinematic hardening (Chaboche model), isotropic hardening (NLISO model) and viscoplasticity (Perzyna model) is developed based on the evaluated fatigue test results. The accuracy of the developed material model is then tested using finite element simulations which are compared with experimental data.