Effect of activated slip systems on dynamic recrystallization during rotary swaging of electro-conductive Al-Cu composites

Abstract

The study focuses on structure investigations of newly designed electro-conductive Al-Cu composites produced via room temperature rotary swaging with constant and altering swaging directions. The swaging route affected the activated slip systems and the development of dynamic recrystallization. Altering the swaging direction supported the activation of {1 0 0} <10-1> slip system at the expense of the {1 1 1} < 1 1 0 > one. All the swaged composites featured the tendency to form four dominant ideal texture orientations - deformation textures Cu (90 degrees,35 degrees,45 degrees), B (120 degrees,55 degrees,45 degrees), and Bb (60 degrees,55 degrees,45 degrees), and recrystallization texture Cube (0 degrees,0 degrees,0-90 degrees). However, their volume fractions differed. Samples swaged with altering direction exhibited high fractions of Cube orientation. Dynamic recrystallization dominated over deformation strengthening for the final 10 mm diameter composite swaged with altering directions. This composite also featured the highest presence of recrystallized grains and the smallest average grain size (6.0 mu m).