Fiber-chip edge coupler with large mode size for silicon photonic wire waveguides

dc.contributor.authorPápeš, Martin
dc.contributor.authorCheben, Pavel
dc.contributor.authorBenedikovič, Daniel
dc.contributor.authorSchmid, Jens H.
dc.contributor.authorPond, James
dc.contributor.authorHalir, Robert
dc.contributor.authorOrtega-Moñux, Alejandro
dc.contributor.authorWangueemert-Pérez, Gonzalo
dc.contributor.authorYe, Winnie N.
dc.contributor.authorXu, Dan-Xia
dc.contributor.authorJanz, Siegfried
dc.contributor.authorDado, Milan
dc.contributor.authorVašinek, Vladimír
dc.date.accessioned2016-04-06T12:17:47Z
dc.date.available2016-04-06T12:17:47Z
dc.date.issued2016
dc.description.abstractFiber-chip edge couplers are extensively used in integrated optics for coupling of light between planar waveguide circuits and optical fibers. In this work, we report on a new fiber-chip edge coupler concept with large mode size for silicon photonic wire waveguides. The coupler allows direct coupling with conventional cleaved optical fibers with large mode size while circumventing the need for lensed fibers. The coupler is designed for 220 nm silicon-on-insulator (SOI) platform. It exhibits an overall coupling efficiency exceeding 90%, as independently confirmed by 3D FiniteDifference Time-Domain (FDTD) and fully vectorial 3D Eigenmode Expansion (EME) calculations. We present two specific coupler designs, namely for a high numerical aperture single mode optical fiber with 6 µm mode field diameter (MFD) and a standard SMF-28 fiber with 10.4 µm MFD. An important advantage of our coupler concept is the ability to expand the mode at the chip edge without leading to high substrate leakage losses through buried oxide (BOX), which in our design is set to 3 µm. This remarkable feature is achieved by implementing in the SiO2 upper cladding thin high-index Si3N4 layers. The Si3N4 layers increase the effective refractive index of the upper cladding near the facet. The index is controlled along the taper by subwavelength refractive index engineering to facilitate adiabatic mode transformation to the silicon wire waveguide while the Siwire waveguide is inversely tapered along the coupler. The mode overlap optimization at the chip facet is carried out with a full vectorial mode solver. The mode transformation along the coupler is studied using 3DFDTD simulations and with fully-vectorial 3D-EME calculations. The couplers are optimized for operating with transverse electric (TE) polarization and the operating wavelength is centered at 1.55 µm.cs
dc.description.firstpage5026cs
dc.description.issue5cs
dc.description.lastpage5038cs
dc.description.sourceWeb of Sciencecs
dc.description.volume24cs
dc.format.extent2056840 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.citationOptics Express. 2016, vol. 24, issue 5, p. 5026-5038.cs
dc.identifier.doi10.1364/OE.24.005026
dc.identifier.issn1094-4087
dc.identifier.urihttp://hdl.handle.net/10084/111443
dc.identifier.wos000371435000069
dc.language.isoencs
dc.publisherOptical Society of Americacs
dc.relation.ispartofseriesOptics Expresscs
dc.relation.urihttp://dx.doi.org/10.1364/OE.24.005026cs
dc.rights©2016 Optical Society of Americacs
dc.rights.accessopenAccess
dc.titleFiber-chip edge coupler with large mode size for silicon photonic wire waveguidescs
dc.typearticlecs
dc.type.statusPeer-reviewedcs
dc.type.versionpublishedVersioncs

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