Investigation of Stress-Strain Behaviour of SAC305 and SACX0807 Lead-Free Solders

Abstract

The thesis is focused on the research of SAC305 and SACX0807 alloys to evaluate their stress-strain behavior under different conditions. Sn-Ag-Cu (SAC) alloys are the most commonly used lead-free solders. This research study focuses mainly on the examination of SAC305, a widely used solder alloy. The Finite Element Method is applied to validate the proposed approach in particular cases. The viscoplastic material model of Anand is used in stress-strain relations to capture the behavior of the solder material. In particular, strain rate sensitivity has been examined by performing uniaxial tensile tests on SAC305 and SACX807 samples at a temperature of 80ºC and under room temperature. All tests were performed at the Faculty of Mechanical Engineering at the VSB-Technical University of Ostrava. In the present investigation of the applicability of hourglass-shaped specimens applicability, a numerical study is performed using Norton model which shows a good correlation with the results obtained by digital image correlation measurement during uniaxial creep testing.