Vliv materiálu tepelného rozhraní na teplotu PCB

Abstract

With the increasing integration of smart technologies into automobile headlights, the demand for efficient heat dissipation from LED diodes is also rising. This work, conducted in collaboration with PO Mobility, focuses on analyzing the thermal behavior of cooling modules composed of PCBs, heat sinks, and thermal interface materials. The main objective of this study is to investigate the impact of the thermal interface material on the PCB temperature and to assess whether it is possible to omit its layer between the PCB and the heat sink in certain cases. This will be achieved through a combination of experimental measurements and numerical simulations, aiming to achieve the highest possible agreement between the simulated and measured results.