Hydrometallurgical recycling process for mobile phone printed circuit boards using ozone

Abstract

Printed circuit boards (PCBs) can be an important source of non-ferrous metals (Al, Sn, Zn, and Ni) and precious metals (Au, Ag, Cu, and Pd). With the continuous increase in demand for metals due to the depletion of ores, recycling of this waste is becoming an attractive alternative. The printed circuits also contain hazardous metals, such as Pb, Hg, As, and Cd. Due to the huge increase in the amount of e-waste, the processing of printed circuit boards for metal recovery and proper handling of hazardous substances has a positive effect on the environment. Pyrometallurgical and hydrometallurgical methods are used for the treatment of this waste. Various oxidizing agents are used in the hydrometallurgical processes, including ozone. PCBs from mobile phones were assessed for the recovery of Cu, Sn, and precious metals. The ground and sieved materials were leached in nitric acid, hydrochloric acid, and sulfuric acid at various process parameters, such as leaching time, leaching agent, and temperature. It was found that the best result was obtained using hydrochloric acid with the addition of ozone at 353 K for a period of 4 h to obtain 68.45 g/dm(3) of copper. Preliminary results of electrolysis and cementation are also presented.