Chlazení LED světlometů

Abstract

This master thesis deals with the structural design of three kinds of power LED chip cooling for daylight function of headlight. The search section presents current methods and ways for solving this problem. After specifying the input and processing requirement list, there was created functional structure, functional hierarchical tree and on this tree basis was created morphological matrix for a pre-selected type of cooling module. Selected concepts were developed into the gross building structure, followed by a clean building structure and these were analyzed for heat transfer. Attention has also been paid to the requirement of maximum temperature of the soldering point.